lionix - microfluidics - integrated optics - foundry services

Microfluidic Substrates

LioniX uses borosilicate glass, fused silica and silicon substrates to fabricate microfluidic chips. We work on 100 mm round substrates for development / prototyping. For production we transfer to 150 mm substrates. Standard substrates are 0.5 mm thick, other thickness and substrate materials on request.

	Borosilicate glass	Fused Silica	Silicon
Why choose this substrate?	For all basic glass chips	UV transparent chips Integrated waveguides DRIE etching	Highest level of technology integration (all semiconductor processes possible)
Technology
Wet etching	1 - 250 microns	1 - 250 microns multilevel	1 - 500 microns (anisotropic) multilevel
DRIE etching	-	1 - 50 microns aspect ratio 1:1	1 - 500 microns aspect ratio 1:10
Powder blasting	Through wafer aspect ratio 1:1	Through wafer aspect ratio 1:1	Through wafer aspect ratio 1:1
Wafer bonding (Temperature in deg C)	Anodic to silicon (450) Direct to borosilicate (600)	Direct to Fused Silica (1050)	Anodic to Borosilicate (450) Direct to silicon (1050)
Integrated waveguide sensors	-	Yes, special	Yes, standard
Integrated electrodes	Yes	Yes	Yes
Physical properties
UV transparency	> 300 nm	> 170 nm	No
Max working temperature (continuous use)	450 deg C	980 deg C	>1000 deg C