Isotropic wet etching of glass

Applications

Etching of microfluidic channels in glass substrates

Capabilities

- Etching of fused Silica and borosilicate glasses
- Sub nanometer surface roughness
- Very low pinhole density of mask materials
- Channel depth typical 1 to 100 microns
- Minimal aspect raio 2:1
- Multilevel etching (up to 2 different channel depth)
- 1% uniformity

Examples