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Capabilities
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- Cr, Au, Ni, Al, Pt, Pd, Ti, Ta, Cu, CuNi, NiFe, W, ... - Thickness typically up to 1000 nm (depending on stress and adhesion) - Sputtering and evaporation - Bilayers / multilayers - Annealing (recrystallisation, stress reduction & diffusion of alloys) - Passivation
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