MEMS Foundry Services

LioniX provides single step foundry services as well as processing of complex structures and components. Our foundry services are performed by LioniX engineers on the equipment from the MESA+ Research Institute. In addition LioniX has its private cleanroom facilities with equipment for our proprietary technologies.

LioniX' microtechnology services are particularly useful for companies developing MST/MEMS-based products, but who fail the access to critical technologies. LioniX' MEMS foundry services are not directed to any particular market, however we experience a particular influx from telecom startups, life science and IPC equipment manufacturers and research institutes.

Our processes are performed on 100 mm silicon, SOI, borosilicate, fused silica and other substrates. We work with carefully selected wafer manufacturers who deliver on request single/double side polished, doping levels, roughness, bow/warp etc. Or you ship your own wafers, blank or processed.

CVD depositions PECVD silicon-oxynitrides (refractive index tuning !! stress tuning !!) LPCVD silicon-rich-nitride (low stress !!) LPCVD silicon-nitride (stoichiometric) LPCVD polysilicon Thermal oxidation (wet and dry) Thermally grown thick SiO2 TEOS silicon oxide
Thin film PVD depositions Metals (Sputtering and evaporation of Cr, Au, Ni, Al, Pt, Pd, Ti, Ta, Cu, CuNi, NiFe, W, Ag, In, ...) Dielectrics (pyrex, silicondioxide, siliconmonixide, ...) Materials with special optical, mechanical or magnetic properties (ZnO, NiFe, Co, ...)
Dry etching Deep RIE of silicon (ICP plasma source, Cryogenic cooling) Deep RIE of glasses (borosilicate and fused silica) Dielectrics (silicon, siliconoxide and siliconnitride with SF6, CHF3, CF4, O2 and other plasmas)
Wet Etching KOH etching of silicon Isotropic wet glass etching in HF Metal etching in various etchants
Wafer bonding Anodic Bonding of borosilicate glasses Direct Bonding and Fusion Bonding of fused silica, silicon and borosilicate glasses
Miscellaneous cleanroom processes Chemical mechanical planarisation (CMP) of silicon oxynitrides and copper Polymers (SU8, Polyimide, ...) Annealing and reflow of silicon oxynitrides Implantations of Boron, Phosphorus and Arsenic Solid source doping (SSD) of Boron Diffusion and drive-in of dopings Electroplating of copper
Inspection Optical Microscpoy Scanning Electron Microscopy (SEM) Atomic Force Microscopy (AFM) Surface Profiling Ellipsometry X-ray Photoelectron Spectroscopy (XPS) Transmission Electron Microscopy (TEM) Energy Dispersive X-ray analysis (EDX) ...
Backend processing Dicing Wire bonding Pigtailing of optical chips Chip-on-Board Assembly Fluidic interfacing
Testing Electrical testing (various wafer probers for wafer level testing of semiconductor parameters, temperature cycling etc.) Fluidic characterisation Optical characterisation