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Deep RIE of Fused Silica

trenches manufactured by deep reactive in etching

Applications

High density microfluidic channels, capillary electrophoresis, EOF driven flows.

Capabilities

- Etching of borosilicate glass and fused silica
- Up to 50 microns
- Positive taper
- Very smooth bottom

This technology was developed in a joint effort of Alcatel Vacuum Technology and LioniX.