Applications
Silicon micromachining, e.g.- Microfluidic channels and ports- MEMS (accelerometers, micromotors etc.)- MOEMS (optical switches, mirrors etc.)- Electrical through wafer interconnects
Capabilities
- Multilevel etching- Aligned front and back side etching- Aspect ratio 1:10- Through-wafer etching- Sidewall inclination (profile) control
Examples
