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Direct Bonding & Fusion Bonding

glass chips for microfluidic applications manufactured by direct bonding

Applications

Microfluidics e.g.
- UV-transparent CE and EOF devices
- Channel plates
- Etc.

Capabilities

- Combinations of fused silica, borosilicate glass and silicon
- Bonding over channels and ports
- Aligned bonding

Examples

examples of direct wafer bonding