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Anodic Bonding

bonded wafer

Applications

Mainly as cover lid for microfluidic channels, e.g. in
- CE and EOF devices
- Micromixers
- Microreactors
- Channel plates
- Etc.

Capabilities

- Silicon to borosilicate glass
- Borosilicate glass to borosilicate glass
- Bonding over channels and ports
- Aligned bonding
- Vacuum bonding

Examples

anodic bonding of structured silicon and glass wafers