The EU-FP7 project BOOM handles about Terabit on Chip:  Micro and Nano-scale silicon photonic integrated components and sub-systems enabling Tb/s-capacity, scalable and fully integrated photonic routers.
The role of LioniX within this project was to implement their proprietary TriPleX technology for the high speed integrated photonic routers. Mach Zehnder Interferometers, Ring resonator matrices and interposers were designed and realized by LioniX.

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